Flex Conference (Physical / Digital)

International Conference on Electronic Materials and Materials Engineering Applications (ICEMMEA - 27)

17th - 18th March 2027, Wuhan, China

Submit Research Paper Attend as Listener
Registration Options → Compare available registration options and proceed with the category that matches your participation type.

Tentative Venue Details :

Shangri-La Hotel, Wuhan
700 Jianshe Ave, XiangGang Lu CanYin Jie, 
Jiangan Qu, Wuhan Shi, Hubei Sheng, 
China

Categories

Important Dates

Early Bird Registration :15th February 2027

Paper Submission Deadline :20th February 2027

Last Date of Registration : 2nd March 2027

Date of Conference : 17th - 18th March 2027

Subscribe to Connect with us