Flex Conference (Physical / Digital)

International Conference on Electronic Materials and Materials Engineering Applications (ICEMMEA - 26)

19th - 20th May 2026, Montreal, Canada

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Call for Paper

The APSTE events aim to release a wide range of articles that provide insight and explore the latest advancements in engineering, medicine, social science, applied science, management etc.

Our conference practices methodological, conceptual, and epistemological diversity. But we prefer articles that effectively engage with current intellectual debates. We expect our participants to contribute innovative ideas, perspectives, and research methods.

Our events can potentially revolutionize the current paradigm and pave the way for growth and development. Those who intend to have their original findings and research published through our events should get an idea from the Author Guidelines, Rules for Presentation, and Instruction sections, before anything else

Engineering

  • Electronic materials
  • semiconductor materials
  • optoelectronic materials
  • dielectric materials
  • ferroelectric materials
  • conductive polymers
  • photovoltaic materials
  • electronic ceramics
  • magnetic semiconductors
  • electronic thin films
  • electronic device materials
  • nanoelectronic materials
  • flexible electronic materials
  • microelectronic packaging materials
  • electronic innovations in materials engineering

Important Dates

Early Bird Registration :19th April 2026

Paper Submission Deadline :29th April 2026

Last Date of Registration : 4th May 2026

Date of Conference : 19th - 20th May 2026

Supporting Academic Continuity

APSTE ensures that research and publication processes continue without interruption in the current global situation. Participants can present their work through digital and integrated formats.

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