Flex Conference (Physical / Digital)

International Conference on Electronic Materials and Materials Engineering Applications (ICEMMEA - 26)

19th - 20th May 2026, Montreal, Canada

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Venue Address

Hôtel Alt Montréal
Address: 120 Peel St
Montreal, Quebec H3C 0L8,
Canada

Categories

Important Dates

Early Bird Registration :19th April 2026

Paper Submission Deadline :29th April 2026

Last Date of Registration : 4th May 2026

Date of Conference : 19th - 20th May 2026

Supporting Academic Continuity

APSTE ensures that research and publication processes continue without interruption in the current global situation. Participants can present their work through digital and integrated formats.

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