Flex Conference (Physical / Digital)

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 27)

Call for Paper

The IC-EPAE provides a supportive platform for both experienced researchers and early-career academicians to present their work and gain recognition. The conference covers diverse topics such as Electrical and Electronics Engineering encouraging participation from emerging researchers and fostering academic growth.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in electronics packaging technologies
  • Thermal management in electronics packaging
  • Reliability testing for electronic assemblies
  • Sustainable practices in electronics packaging
  • Integration of IoT in packaging systems
  • Challenges in electronics assembly processes
  • Quality control in electronics packaging
  • Emerging materials for electronics packaging
  • Design considerations for electronic assemblies
  • Automation in electronics manufacturing
  • Future trends in electronics packaging
  • Supply chain management for electronics assembly
  • Impact of 5G on electronics packaging
  • Electromagnetic compatibility in packaging
  • Case studies in electronics packaging engineering
  • Packaging solutions for wearable electronics
  • Robustness of electronic assemblies
  • Testing methodologies for electronics packaging
  • Industry standards for electronics packaging
  • Research directions in electronics assembly

Review & Publication

Submissions will be reviewed to ensure quality and relevance, with a focus on encouraging emerging research contributions. Accepted papers will be presented and considered for publication opportunities.

Registration

Early-career researchers are encouraged to register and present their work, gaining valuable feedback and academic exposure.

Publication

The conference provides opportunities for emerging researchers to publish their work in recognized platforms.

Important Dates

Early Bird Registration :27th January 2027

Paper Submission Deadline :1st February 2027

Last Date of Registration : 11th February 2027

Date of Conference : 26th - 27th February 2027