Flex Conference (Physical / Digital)

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 27)

26th - 27th February 2027, British Columbia, Canada

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Tentative Venue Details :

Harrison Lake Hotel


190 Lillooet Rd, Harrison Hot Springs, BC V0M 1K0, Canada

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Important Dates

Early Bird Registration :27th January 2027

Paper Submission Deadline :1st February 2027

Last Date of Registration : 11th February 2027

Date of Conference : 26th - 27th February 2027

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